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FacultyCV

Chanman Park

Mechanical and Aerospace Engineering
Graduate School of Engineering and Applied Sciences

Phone: (831) 656-3210

Overview

Ph.D., Materials Science, 09/2000
University of Southern California (USC)
M.S., Materials Science, 06/1995
University of Southern California (USC)
B.S., Materials Science and Engineering, 07/1993
University of California, Los Angeles (UCLA)
Research Interests
PUBLICATIONS:

1. James R. Ley, Young W. Kwon, Chanman Park & Sarath K. Menon, “Corrosion of femtosecond laser surface textured aluminum alloy”, Corrosion Engineering, Science and Technology; The international Journal of Corrosion Processes and Corrosion Control, 2017, ISSN: 1478-422X
2. Y.W. Kwon, H.F. Teo, C. Park, “Cyclic Loading on Composite Beams with Fluid-structure Interaction”, Experimental Mechanics, Apr. 2016, Vol 56, Issue 4, pp 645-652
3. Y.W. Kwon, Y. Esaeili and C.M. Park“Stress-Strain Behavior of an Aluminum Alloy under Transient Strain-Rates”, Journal of Pressure Vessel Technology, Apr. 2011, Vol 133.
4. C. Park, X Long, S Haberman, S Ma, I Dutta, R Mahajan, SG Jadhav, “A comparison of impression and compression creep behavior of polycrystalline Sn”, Journal of materials science, July, 2007, Vol 41, Issue 13, pp5182-5187
5. I Dutta, C Park, J Vella, “Effect of internal stresses on thermos-mechanical stability of interconnect structures in microelectronic devices”, Materials Science and Engineering A, Apr. 2006, Vol 421, Issue 1, pp 118-132
6. I Dutta, KA Peterson, Chanman Park, J Vella, “Modeling of interfacial sliding and film crawling in back-end structures of microelectronic devices”, IEEE Transaction on components and packaging technologies, Sep. 2005, Vol 28, Issue 3, pp 397-407
7. I. Dutta, C. Park, S Choi, “Impression creep characterization of rapidly cooled Sn-3.5Ag solders”, Materials Science and Engineering:A, Aug. 2004, Vol 379, Issue 1, pp401-410
8. C Park, TE Shultz, I Dutta, “Environmentally protected hot-stage atomic force microscope for studying thermos-mechanical deformation in microelectronic devices”, Review of scientific instruments, Nov. 2004, Vol 75, Issue 11 pp 4662-4670
9. I Dutta, C Park, J Vella, D Pan, “Interfacial sliding and plasticity in back-end interconnect structures of microelectronic devices”, Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on, pp83-90
10. C Park, I Dutta, KA Peterson, J Vella, “AFM studies of deformation and interfacial sliding in interconnect structure in microelectronic devices”, MRS online proceedings library archive, Jan. 2003, Vol 766
11. YW Kwon, RE Cooke, C Park, “Representative unit-cell models for open-cell metal foams with or without elastic filler”, Materials Science and Engineering A, Feb. 2003, Vol 343, pp 63-70
12. C Park, I Dutta, KA Peterson, J Vella, “Deformation and interfacial sliding in back-end interconnect structures in microelectronic devices”, journal of electronic materials, Oct. 2003, Vol 32, Issue 10, pp1059-1071
13. I Dutta, KA Peterson, C Park, “Interfacial creep in multi-component material systems”, JOM Jan. 2003, Vol 55, Issue 1, pp 38
14. I Dutta, C park, S Choi, “Creep and microstructural evolution in lead-free microelectronic solder joints”, Proceedings of InterPACK, Jan. 2003, Vol 3, pp 1-6
15. KA Peterson, C Park, I Dutta, “Interfacial sliding in back-end interconnect structures in microelectronic devices”, MRS Online Proceedings Library archive, Jan 2002, Vol 716
16. C Park, I Dutta, KA Peterson, J Vella, “Deformation and Interfacial Sliding in Back-End Interconnect Structures in Microelectronic Devices’, Journal of electronic materials, 2003, Vol 32, Issue 10, pp1059-1071
17. Chanman Park and Steven R. Nutt, "Strain Rate Sensitivity and Defects in Steel Foam", Mater. Sci. Eng., 323 (2002) 358.
18. Chanman Park and Steven R. Nutt, "Anisotropy and Strain Localization in Steel Foam", Mater. Sci. Eng., 299 (2001) 68.
19. Chanman Park and Steven R. Nutt, "Effect of Process Parameters on Steel Foam Synthesis", Mater. Sci. Eng., 297 (2001) 62.
20. Chanman Park and Steven R. Nutt, "PM Synthesis and Properties of Steel Foams", Mater. Sci. Eng. 288 (2000) 111.
21. Chanman Park and Steven R. Nutt, "Metallographic Study of GASAR Porous Magnesium", Mat. Res. Soc. Symp. Proc. 521, 315 (1998)


TECHNICAL REPORTS:

[1] Chanman Park, “Failure of Fuel Oil Fill and Transfer Piping on DDG 90 USS CHAFEE”, Report to Navy Ship Yard; Metallurgy, SEM, EDAX, Electro-polishing, Electro-etching.

[2] Chanman Park, “Hardness measurement of Friction Stir nickel aluminum bronze material”, Report to Rockwell Science Center; Metallurgy, Microhardness test.

CONFERENCE PRESENTATIONS:

[1] C Park, C Dominguez, M Sanchez, J Gomez, and CC Luhrs, “Fabrication and Mechanical behavior of carbon nanofiber foam core-polymeric shell structures”, 145th TMS Meting (Feb. 14-18, 2016, Nashville, Tennessee, USA)

[2] K. Oh-ishi, A.M. Cuevas, Chanman Park and T.R. McNelley, “Microstructure evolution during FSP of an As-cast NAB material”, 132nd TMS Meeting (March 3-6, 2003, San Diego, California, USA)

[3] K. Oh-ishi, A.M. Cuevas, Chanman Park and T.R. McNelley, “The inflrence of friction stir processing on microstructure and properties of a cast nickel aluminum bronze material”, THERMEC2003, International Conference on Processing and manufuring of Advanced Materials (Madrid, Spain, July 7-11 2003)

[4] Y.W. Kwon, R.E. Cooke and Chanman Park, “Modeling of open-cell metallic foams for sandwich structures”, 6th International Conference on Sandwich Structures (March 31-April 2, 2003 Ft. Lauderdale, Florida)

[5] K. A. Peterson, Chanman Park and I. Dutta, “Interfacial sliding in back-end interconnect structures in microelectronic devices”, 132nd TMS Meeting (March 3-6, 2003, San Diego, California, USA)

[6] Chanman Park, I Dutta, K.A. Peterson, and J. Vella, “AFM studies of deformation and interfacial sliding in interconnect structures in microelectronic devices”, Materials Research Society Spring Meeting (April 21-25, 2003, San Francisco, California, USA)

[7] K. A. Peterson, Chanman Park and I. Dutta, “Interfacial sliding in back-end interconnect structures in microelectronic devices”, Materials Research Society Spring Meeting (April 1-5, 2002, San Francisco, California, USA) “Nominee”

[8] Chanman Park and Steven R. Nutt, "Metallographic Study of GASAR Porous Magnesium", Materials Research Society Spring Meeting (April 13-15, 1998, San Francisco, California, USA)

[9] Chanman Park and Steven R. Nutt, "Production of Steel Foams", TMS Annual Meeting (February 28-March 4, 1999, San Diego, California, USA)mechanical properties