Cleanroom - Center for Materials Research
Cleanroom
Deposition/Etching
Oxford Plasmalab Systems 100
A plasma etching system designed deposit and etch silicon based thin films. It uses PECVD process to deposit silicon, silicon dioxide or silicon nitride thin films. It can dry-etch silicon-based semiconductor or dielectric films using inductively coupled plasma (ICP) and BOSCH processes for bulk etching of silicon. We also have a capability to do a liquid nitrogen cooling.
Sirus T2 Reactive Ion Etcher
A basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.
Angstrom Covap
A resistive thermal evaporation system capable of deposition of up to two metal films at a time (upgradable to 4).
Resistive evaporation is a commonly used vacuum deposition process in which electrical energy is used to heat a filament which in turn heats a deposition material to the point of evaporation. The process can be performed at very high levels of vacuum allowing for a long mean free path and therefore fewer tendencies to introduce film impurities. High deposition rates can be achieved and lower energy particles can reduce substrate damage.
Angstrom Engineering has developed thin film deposition systems based on this technique which can deposit a wide range of materials including metals, organic, and inorganic polymers. The process can be controlled using quartz rate sensor, temperature, or optical monitoring systems to ensure consistent high-quality results.
Angstrom NexDep
A sputter film deposition system capable of deposition of up to four metal films at a time.
Sputter coating is a commonly used vacuum deposition process in which a beam of ionized gas is incident on a material disk, sputtering the atoms that in turn coat the sample. The process can be performed at very high levels of vacuum allowing for a long mean free path and therefore fewer tendencies to introduce film impurities. High deposition rates can be achieved and lower energy particles can reduce substrate damage.
This system has capability of RF, DC, pulsed DC and HIPIMS deposition and 4 sources.
FirstNano EasyTube 2000
EasyTube™ 2000 System is an advanced turnkey thermal catalytic chemical vapor deposition process tool for the synthesis of a wide variety of nanostructured materials. The system is optimized for controlled process development and user safety.
EasyTube™ 2000 is easy to use with PC controlled recipe driven software that automatically acquires and logs data for verifiable repeatability.
The graphical user interface (GUI) allows users to logically access preprogrammed recipes, modify and/or create recipes and view real time execution data.
Cee® 200X Precision Spin Coater
Delivers track-quality performance for photoresist, thin film, or other process chemical coating applications. Fully programmable and user-friendly, the Cee® 200X features the accuracy and repeatability needed to eliminate processing variability from photoresist and thin film deposition processes. With its convenient compact footprint, chemical compatibility, and durability, this easy-to-use benchtop system will provide years of high-performance spin coating, making the Cee® 200X purchase a smart and cost-effective decision for applying coatings to substrates up to 200 mm round or 7" square.
Cee® Apogee Spin Developer
Delivers track-quality development and cleaning capabilities. Fully programmable and user-friendly, the Cee® Apogee features the accuracy and repeatability needed to eliminate processing variability from photoresist and thin film development processes. The use of side-angle spray nozzles (45º) significantly enhances fluid deposition uniformity. The standard configuration utilizes two side-spray nozzles to evenly apply developer solution across the substrate. These nozzles are positioned to spray from the center of the wafer out. With its convenient compact footprint and durability, this easy-to-use benchtop system is a high-performance developer for substrates up to 200 mm round or 7" square.
Photolithography/Wet Etching
EVG 620 Contact Aligner
Versatile, comprehensive contact aligner. It can be easily reconfigured for handling 2", 4" and 6" wafers. Capable of a wide range of recipes and both frontside and backside alignment.
Canon PLA 501S Contact Aligner
A durable contact top-side aligner capable of handling 5 inch masks and 4 inch wafers.
Characterization
Zygo NewView 7100
The Zygo 7100 optical profilometer is a scanning white light interferometer used for non-contact surface profiling of samples. It measures surface roughness and texture, MEMS device dimensions, and is a general purpose metrology instrument.